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A change in the way TSMC makes chips for Apple could mean a lot more variation in performance for the iPhone 18 models, by Apple switching combinations of CPU, GPU, and Neural Engine.
Dies on wafers – Image credit: TSMC
One of the problems with chip production is that manufacturers are usually locked into a few specific chip designs, due to the expense and difficulty of creating each one. However, using a new technique will potentially allow TSMC to provide Apple with far more flexibility than ever before.
According to analyst Ming-Chi Kuo on Tuesday, Eternal Materials has been named as an advanced packaging materials supplier to TSMC. Eternal will become the only supplier of the liquid molding compound (LMC) and molding underfill (MUF), used to encapsulate chips, for Apple’s 2026 iPhone and Mac chip generations.
Rumor Score: 🤔 Possible
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