The die is cast: A close-up view of Apple’s A19 SoC

The A19 is a considerable refinement over the A18 in terms of chip construction, a microscopic view of the iPhone 17 SoC has demonstrated.

A19 Pro – Image Credit: Apple

The iPhone 17 generation brought with it the new A19 and A19 Pro chips, which bring more improvements to Apple’s in-house chip design. While Apple makes claims about various performance improvements, photography of the new SoC design provides a visual indication of changes, if not a complete overhaul.

The shots by ChipWise show both the front and the back of the die itself, but the backside view is the most informative. The shots, the first high-resolution microscopy of the chip, provides a high-detail view of the chip’s layout, made using TSMC’s third-generation 3-nanometer process, N3P.

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